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SPECIFICATION
PART NO. : MT430-G-A 4.9mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES
MT430-G-A
Description
4.9mm ROUND LED LAMP
This green lamp is made with GaP/GaP chip and green clear epoxy resin.
6.1
4.9 1.7 6.4
Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted.
0.5 MAX.
A
24.0 MIN.
K
1.5 TYP.
2.540.1
Description
LED Chip Part No.
Material GaP/GaP Emitting Color Green
Lens Color
MT430-G-A
Green clear
VER.: 01
Date: 2007/10/24
Page: 1/5
MT430-G-A
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation Reverse Voltage D.C. Forward Current Reverse (Leakage) Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body)
4.9mm ROUND LED LAMP
Symbol
PD VR If Ir If(Peak) Topr. Tstg. Tsol
Rating
78 5 30 100 100 -40 to +95 -40 to +100 Dip Soldering : 260 Hand Soldering : 350
Unit
mW V mA A mA
for 5 sec. for 3 sec.
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse (Leakage) Current Viewing Angle Spectrum Line Halfwidth 2
Symbol
IV Vf p d Ir 1/2
Condition
If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA
Min.
37.2
Typ.
70.0 2.1 567
Max.
145 2.6
Unit
mcd V nm
564
572
579 100
nm A deg nm
30 35
Notes:1. The datas tested by IS tester. 2. Customer's special requirements are also welcome.
VER.: 01
Date: 2007/10/24
Page: 2/5
MT430-G-A
4.9mm ROUND LED LAMP
Typical Electrical / Optical Characteristics Curves :
50
100 Relative Luminous Intensity 80 60 40 20 0
Forward Current IF(mA)
40 30 20 10
1.2
1.6
2.0
2.4
2.8
3.2
0.0
10.0
20.0
30.0
Applied Voltage (V)
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
FORWARD CURRENT VS.APPLIED VOLTAGE
0
50 40
10
20 30
Forward Current IF(mA)
40
30 20 10
1.0 0.9 0.8
50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6
0.7
0 20 40 60 Temperature ( ) 80 100
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01
Date: 2007/10/24
Page: 3/5
MT430-G-A
Specifications for Bin Grading: Iv(mcd) BIN H J K L Specifications for Vf Group: Vf(V) Group V1 V2 V3 V4 V5 MIN. 1.6 1.8 2.0 2.2 2.4 MIN. 37.2 52.0 72.8 102
4.9mm ROUND LED LAMP
MAX. 52.0 72.8 102 145
MAX. 1.8 2.0 2.2 2.4 2.6
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group: D(nm) @20mA Group X4 X5 X6 X7 X8 MIN. 564 567 570 573 576 MAX. 567 570 573 576 579
VER.: 01
Date: 2007/10/24
Page: 4/5
MT430-G-A
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use
4.9mm ROUND LED LAMP
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 . At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) (3) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Solder dip: Preheat: 90 Solder bath: 260 5 Soldering iron : 350 max. (Backside of PCB), Within 60 seconds (Solder temperature), Within 5 seconds max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.
VER.: 01
Date: 2007/10/24
Page: 5/5

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